| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can accurately control a reflow distance L to a desired value. SOLUTION: Gas is blown from a gas diffusing part formed on the outer wall of a diffusing member 23 having a hollow part into a chamber 101. Further, the gas is blown to the substrate 1 through the openings 211 formed on a gas blow out plate 21. Since the gas is made in concentration uniform in the diffusing member 23 and is blown uniformly onto the substrate 1 via the gas blow out plate 21, the reflow distance L can be accurately controlled over the entire surface of the substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
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