| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrain a conductive wiring layer 12A from increasing its resistance when high-frequency signals flow through it, and to improve the adhesion of the conductive wiring layer 12A to sealing resin 17. <P>SOLUTION: The surface of the conductive wiring layer 12A is made smooth so as to restrain the wiring layer 12A from increasing its resistance due to a skin effect when high-frequency signals flow through the conductive wiring layer 12A. Furthermore, the surface of the peripheral part of the conductive wiring layer 12A is turned rough, whereby the conductive wiring layer 12A can be improved in adhesion to the sealing resin 17. A frame-shaped dummy conductive wiring layer 12D is provided so as to surround the conductive wiring layer 12A, and the surface of the dummy conductive wiring layer 12D is turned rough, so that the dummy conductive wiring layer 12D can be improved in adhesion to the sealing resin 17. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
