| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently forming a thin multilayer circuit board having fine conductive circuits at low costs, and to provide a circuit board formed by the method. SOLUTION: The method is provided for manufacturing the circuit board which consists of an insulating resin layer having via holes and a circuit portion. The method comprises steps of forming the circuit portion on a substrate surface with a conductive paste, forming the insulating resin layer on a surface for forming circuits, punching holes at desired positions in the insulating resin layer, filling the punched holes with a conductive paste for via holes followed by drying, and removing the board. COPYRIGHT: (C)2004,JPO&NCIPI |
