| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition and a photosensitive material having excellent photosensitive characteristics and storage stability, and to provide a method of manufacturing a relief pattern and a method of manufacturing a polyimide pattern to form a polyimide pattern having excellent heat resistance, adhesion property and chemical resistance. <P>SOLUTION: The photosensitive composition is constituted by containing: a phenol compound expressed by general formula (I); a titanocene compound expressed by general formula (II); 3-aminopropyl trialkoxysilane expressed by general formula (III); and an addition polymerizable compound. The compound of formula (I) is, for example, phenol or ortho-cresol, and the compound of formula (II) is, for example, bis (cyclopentadienyl)-bis[2,6-difluoro-3-(2,5-dimethylpyrrol-1-yl)phenyl]titanium. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
