| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus for semiconductor device which assures sufficient corrosion-proof characteristic for the corrosive gas and can produce semiconductor device at lower cost in comparison with the apparatus using individual platinum and tantalum or the like. SOLUTION: As the mother material, stainless steel is used, while as a corrosion-proof metal at the surface to be in contact with gas, tantalum is used, respectively. Moreover, a binder metal is also provided between the mother material and the corrosion-proof metal. COPYRIGHT: (C)2004,JPO&NCIPI
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