| 摘要 |
PROBLEM TO BE SOLVED: To form wiring having high reliability by electroplating, and to improve the yield in device production thereby. SOLUTION: The face to be plated in a substrate 100 is dipped into a plating liquid 111 stored in a plating treatment tank 110 in an overflow state so that the face to be plated lies downward, and further, the contact between the non-plated part in the substrate 100 and the plating liquid 111 is prevented by using a seal part 103, so that the substrate 100 is subjected to plating treatment. Thereafter, at least the seal part 103 is cleaned with pure water by using a cleaning mechanism 150, so that the plating liquid 111 stuck to the seal part 103 is removed. COPYRIGHT: (C)2004,JPO&NCIPI
|
