| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern by which a resist pattern with good controlling property of the pattern size can be formed, to provide a positive resist composition to be used for the method, and to provide a laminate using the positive resist composition. <P>SOLUTION: The method for forming a resist pattern includes processes of applying the following resist composition on a substrate, prebaking, selectively exposing, subjecting to post exposure baking (PEB), developing with an alkali to form a resist pattern, and then heat treating to reduce the pattern size of the obtained resist pattern. The positive resist composition contains: (A) a resin component which has a structural unit (a1) derived from a (meth)acrylate expressed by general formula (I) and which increases the alkali solubility by the effect of an acid; and (B) an acid generating agent component which generates an acid by exposure. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
