发明名称 CONDUCTIVE SHEET AND VESSEL FOR ELECTRONIC PART CONVEYANCE
摘要 PROBLEM TO BE SOLVED: To provide a well-balanced conductive sheet and a vessel for electronic part conveyance excellent in mechanical strength (including breakability), moldability, a slit property, surface conductivity, appearance and cost, in whatever shape of an embossed carrier tape it is processed. SOLUTION: The conductive sheet is made by fitting a conductive layer having an antistatic performance with a surface resistivity value of 1×10<SP>4</SP>Ω/square or more and less than 1×10<SP>10</SP>Ω/square at least on one side of a base material sheet made of a styrene system resin composition giving the sheet an excellent slit property. It is preferable that the styrene system resin composition giving the sheet a slit property be made to contain a polymer alloy consisting of 99.5 to 85 wt% of the styrene system resin (A), 0 to 10 wt% of polyolefin (C), and 0.2 to 10 wt% of a filler (B). Further, the conductive layer is preferred be turned into a multilayered sheet by an extrusion method together with the styrene system composition giving the sheet a slit property. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004185928(A) 申请公布日期 2004.07.02
申请号 JP20020350415 申请日期 2002.12.02
申请人 SUMITOMO BAKELITE CO LTD 发明人 YONEZAWA MASATERU
分类号 B65D73/02;B32B27/30;B65D65/02;B65D85/86;C08K3/04;C08L25/04;H01B5/14;(IPC1-7):H01B5/14 主分类号 B65D73/02
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