| 摘要 |
Embodiments of the present invention provides an electronic component cooling system and method that diverts a portion of a cooling fan's cooling air from high power electronic components such as processors and directs the cooling air to other electronic components of a system. Active cooling air may be provided at higher velocities and lower temperatures to cool electronic components of a system such as a computer or other electronic device. An attach block may be thermally coupled to a first electronic component. A heat exchanger may be thermally coupled to the attach block. A cooling fan may receive inlet air and may generate cooling air. A plenum duct between the cooling fan and the heat exchanger may direct the generated cooling air from the fan to the heat exchanger. A portion of the generated cooling air from the cooling fan may be diverted towards a second electronic component included in the system.
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