发明名称 |
MULTICHIP MODULE INCLUDING SUBSTRATE WITH AN ARRAY OF INTERCONNECT STRUCTURES |
摘要 |
A multichip module is disclosed. In one embodiment, the multichip module includes a substrate having a first side and a second side, the first side being opposite to the first side. A driver chip is at the first side of the substrate. A semiconductor die comprising a vertical transistor is at the second side of the substrate. The driver chip and the semiconductor die are in electrical communication through the substrate.
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申请公布号 |
US2004125573(A1) |
申请公布日期 |
2004.07.01 |
申请号 |
US20020330741 |
申请日期 |
2002.12.26 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
JOSHI RAJEEV;ESTACIO MARIA CRISTINA B. |
分类号 |
H05K1/03;H05K1/14;H05K1/18;H05K3/34;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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