发明名称 |
Power semiconductor device having semiconductor-layer-forming position controlled by ion implantation without using photoresist pattern, and method of manufacturing such power semiconductor device |
摘要 |
A first insulator (710) having an opening within a central region (551) is formed on a main surface (61S) of an epitaxial layer (610). Then, p-type impurities are ion implanted through the opening of the first insulator (710) and then heat treatment is carried out, thereby to form a p base layer (621) in the main surface (61S). An insulating film is formed to fill in the opening and then etched back, thereby to form a second insulator (720) on a side surface (71W) of the first insulator (710). Under conditions where the second insulator (720) is present, n-type impurities are ion implanted through the opening and then heat treatment is carried out, thereby to form an n<+> source layer (630) in the main surface (61S) of the p base layer (621).
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申请公布号 |
US2004124464(A1) |
申请公布日期 |
2004.07.01 |
申请号 |
US20030437062 |
申请日期 |
2003.05.14 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NARAZAKI ATSUSHI |
分类号 |
H01L21/331;H01L21/336;H01L29/06;H01L29/08;H01L29/10;H01L29/423;H01L29/739;H01L29/78;(IPC1-7):H01L29/76 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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