发明名称 High frequency substrate
摘要 A high frequency substrate comprises at least a metal layer, a dielectric layer and a high frequency signal transmission line is provided. Of which, the dielectric layer, which is formed on the metal layer, has a dense structure and a number of closed voids with a filling material stuffed therein. Since the dielectric constant of a material is smaller than that of the dense structure, the overall dielectric constant of the dielectric layer is smaller than that of the dense structure. When the high frequency signal transmission line is deposited on the dielectric layer, the signal transmission speed in the high frequency signal transmission line will be improved, the energy loss of signals will be attenuated and so will signal transmission quality be maintained.
申请公布号 US2004124955(A1) 申请公布日期 2004.07.01
申请号 US20030712524 申请日期 2003.11.13
申请人 WU SUNG-MAO;CHEN KUN-CHING 发明人 WU SUNG-MAO;CHEN KUN-CHING
分类号 H01P3/08;H05K1/02;H05K1/03;(IPC1-7):H01P3/08 主分类号 H01P3/08
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