发明名称
摘要 In a flexible multilayer wiring board, a first conductive pattern provided on a first flexible base material and a second conductive pattern provided on a second flexible base material are made to conduct via a first conductive body filled in a first through hole. Hereby, a flexible multilayer wiring board of which the productivity is satisfactory, which is low-priced and highly reliable in connection can be provided.
申请公布号 KR100437928(B1) 申请公布日期 2004.06.30
申请号 KR20010042801 申请日期 2001.07.16
申请人 发明人
分类号 H05K1/14;H05K3/46;B32B3/00;H05K1/00;H05K1/02;H05K3/28;H05K3/32;H05K3/36;H05K3/40 主分类号 H05K1/14
代理机构 代理人
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