| 摘要 |
<p>A printed circuit board recycle method and apparatus thereof capable of separately collecting a metal material including wiring metal material and an insulation material constituting a printed circuit board and reutilizing the collected wiring metal material and the insulation material. Among the processes related to the recycle method of the printed circuit board, in a heating/filtration step (P400), by using a heating/filtration apparatus (4a) or a resin-metal separation apparatus (51), a printed circuit board (1) to be discarded is heated and forcibly filtrated, so that only the insulation material (1a) is passed, thereby isolating the insulation material (1a) from the metal material (1b). It should be noted that a printed circuit board substrate (100) having an insulation substrate (23) formed by a thermo-plastic resin or a mixture of a thermo-plastic resin and an inorganic filling material is applied to the printed circuit board to be discarded. Thus, when the collection amounts of the both have reached the amounts necessary for reutilization, the both can be reutilized.</p> |
