Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device

摘要

A technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as an interconnect array (200) for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device having a plurality of electrically conductive signal path layers. In such a case, the interconnect array (200) comprises a plurality of electrically conductive contacts (202) grouped into a plurality of arrangements of electrically conductive contacts (202), wherein each of the plurality of arrangements of electrically conductive contacts (202) are separated from other adjacent ones of the plurality of arrangements of electrically conductive contacts (202) by a channel (206,208) that is correspondingly formed in the multilayer signal routing device such that an increased number of electrical signals may be routed therein on the plurality of electrically conductive signal path layers.