发明名称 Process for forming a metal particle ordered structure
摘要 In order to preventing thiol-coated metal particles from being liberated from a self-aligning membrane on a substrate during coating the metal particles deposited on the self-aligning membrane with thiol molecules, this invention provides a process for forming a metal particle ordered structure wherein a voltage is applied on the substrate for preventing the metal particles from being liberated from the self-aligning membrane during coating the metal particles deposited on the self-aligning membrane on the substrate with thiol molecules.
申请公布号 US6755953(B2) 申请公布日期 2004.06.29
申请号 US20020149547 申请日期 2002.06.12
申请人 NEC CORPORATION;JAPAN SCIENCE AND TECHNOLOGY CORPORATION 发明人 BABA MASAKAZU
分类号 H01L29/06;B05D7/24;C25D1/00;C25D13/00;C25D15/00;H01L29/15;H01L29/66;H01L51/10;H01L51/40;(IPC1-7):C25D1/00 主分类号 H01L29/06
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