发明名称 |
Process for forming a metal particle ordered structure |
摘要 |
In order to preventing thiol-coated metal particles from being liberated from a self-aligning membrane on a substrate during coating the metal particles deposited on the self-aligning membrane with thiol molecules, this invention provides a process for forming a metal particle ordered structure wherein a voltage is applied on the substrate for preventing the metal particles from being liberated from the self-aligning membrane during coating the metal particles deposited on the self-aligning membrane on the substrate with thiol molecules.
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申请公布号 |
US6755953(B2) |
申请公布日期 |
2004.06.29 |
申请号 |
US20020149547 |
申请日期 |
2002.06.12 |
申请人 |
NEC CORPORATION;JAPAN SCIENCE AND TECHNOLOGY CORPORATION |
发明人 |
BABA MASAKAZU |
分类号 |
H01L29/06;B05D7/24;C25D1/00;C25D13/00;C25D15/00;H01L29/15;H01L29/66;H01L51/10;H01L51/40;(IPC1-7):C25D1/00 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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