CHEMICAL MECHANICAL POLISHING EQUIPMENT AND SLURRY SUPPLY APPARATUS THEREOF

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) equipment and a slurry supply apparatus thereof are provided to uniformly polish a wafer by using at least one movable nozzle. CONSTITUTION: A CMP equipment is provided with a platen(2) for being attached with a polishing pad(4), a conditioner(16) installed on the platen for conditioning the polishing pad, and a polishing head(12) installed at the upper portion of the resultant structure for loading a wafer and pressurizing the wafer downward. The CMP equipment further includes a slurry supply apparatus(20) for supplying slurry from at least one position to the wafer. At this time, the slurry supply apparatus includes at least one movable nozzle(22).