| 摘要 |
PROBLEM TO BE SOLVED: To provide an atmosphere robot handing apparatus for making the throughput improved. SOLUTION: A semiconductor manufacturing tool 30 has two loadlocks 36, 40; one of these is used for a semiconductor wafer which enters, the tool 30 to be processed, and the other is used for a wafer exiting the tool 30, after the treatment. The tool 30 attains a high throughput which is enabled by the loadlocks 36, 40 in relation with three atomospheric wafer handling robots 44, 46, 48. The first robot 44 transfers an unprocessed wafer from a supply source to a wafer prealigner 50, the second robot 46 transfers the wafer from the wafer prealigner 50 to the loadlock 36, through which the wafer enters the tool 30, and the third robot 48 transfers the treated wafer from the loadlock 40 through which the wafer exits the tool 30 and is transferred to a supply source 42. COPYRIGHT: (C)2004,JPO
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