| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be improved in heat dissipating properties by providing a metal layer on a semiconductor element and reduced in size, to provide its manufacturing method, a semiconductor package, and its manufacturing method. SOLUTION: The figure indicates the semiconductor package containing the semiconductor device 50 related to a first one of the embodiments. As shown in the figure, the semiconductor device 50 related to one of the embodiments is equipped with a relay board 30 containing a first wiring pattern, and the first semiconductor element 10 containing an electrode 12 electrically connected to the first wiring pattern. Furthermore, the semiconductor device 50 may be equipped with external terminals 16 which are electrically connected to the first wiring pattern protruding from the surface of the relay board 30. COPYRIGHT: (C)2004,JPO
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