发明名称 |
Pad assembly for electrochemical mechanical processing |
摘要 |
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
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申请公布号 |
US2004121708(A1) |
申请公布日期 |
2004.06.24 |
申请号 |
US20030727724 |
申请日期 |
2003.12.03 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HU YONGQI;TSAI STAN D.;WANG YAN;LIU FENG Q.;CHANG SHOU-SUNG;CHEN LIANG-YUH |
分类号 |
B23H5/06;B23H5/08;B23H5/10;B24B37/04;B24B37/22;B24B37/24;B24B37/26;B24B49/16;B24B53/007;B24B53/017;B24D13/14;H01L21/321;(IPC1-7):B24B7/19 |
主分类号 |
B23H5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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