| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip transfer station for an improved type bonding machine wherein a chip can be fitted in high accuracy and a precise chip or the contact track of a circuit board is hardly damaged thanks to stablized operation in the chip transfer station of a flip-chip bonding device that picks up an electronic circuit prepared in a transfer film and transfers it to a ceramic board. SOLUTION: A transfer unit 1 is provided with a driving motor 3, a belt transmitting mechanism 5 coupled therewith and a suction needle reversing means 7 driven thereby. The suction needle reversing means is provided with a suction needle holder seating on a rotary shaft A and a pulley 9 connected with the rotary shaft in unrotational state. The suction needle holder is provided with a guide block with a suction needle carriage that can move only in Z direction, and it supports a suction needle as well as a mating pin or a bold parallel to the rotary shaft. COPYRIGHT: (C)2004,JPO
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