| 摘要 |
PROBLEM TO BE SOLVED: To provide a sample-fixing instrument for eliminating the need for an adhesive, such as, wax, silver paste, carbon paste, conductive tape, for efficiently and accurately polishing the cross section of a sample (e.g., a device cross section as a desired observation cross section of a semiconductor chip) so that it appears and being installed to an analysis apparatus after polishing, as it is. SOLUTION: The sample-fixing instrument 10 is provided with an attachment jig 1 for a polishing apparatus, a base 2, a sample-fixing intermediate plate 3, a sample-fixing part 4 and an attachment screw 5. Since the attachment jig 1 for the polishing apparatus can be replaced with an attachment jig (not shown) to the analysis apparatus, the sample-fixing instrument can be installed to the polishing apparatus or the analysis apparatus as the sample, such as the semiconductor chip is attached to the sample-fixing instrument. COPYRIGHT: (C)2004,JPO
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