| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processor wherein a stocking space for cooling processed substrates or making them wait therein is disposed without increasing substantially the occupied area of the whole of the processor. <P>SOLUTION: In the front of a case 1, a pair of openings 2 for coupling the apertures of FOUPs F to the inside of the case 1 in an airtight way are provided separately from each other on both the sides of the front. Also, in the positions lower than the openings 2, a pair of FOUP mounting portions 4 are overhung from the case 1 separately from each other on both the sides of the front. Further, an expanding portion 5 is so formed between the pair of FOUP mounting portions 4 as to use the inside of the expanding portion as a stocking space 6 for cooling processed substrates or making them wait therein. <P>COPYRIGHT: (C)2004,JPO |
