| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce troubles, such as voids, wire deformations and the like, and to use resin materials effectively when a chip mounted on a board is sealed up with resin. <P>SOLUTION: A board 14 is mounted on a board placing part 11 when a lower mold 1 and an upper mold 2 are kept open, a resin material 4 which is prepared conforming to the dimensions/outlines of a cavity 5 is provided on the molding surface of the cavity 5. The resin materials 4 are heated into molten resin 17, and the upper mold 2 is made to descend to carry out mold clamping as the space between the lower mold 1 and the upper mold 2 is depressurized through a gas flow path 7, whereby a chip 15 and wires 16 are dipped into the molten resin 17. Furthermore, the molten resin 17 is turned to cured resin, a mold is formed of the board 14 and the cured resin, the lower mold 1 and the upper mold 2 are opened, and a molded body is taken out. By this setup, the molten resin 17 flows uniformly in the depthwise direction of the cavity 5 in a short time, so that troubles, such as voids, deformation of the wires 16 and the like, can be prevented. <P>COPYRIGHT: (C)2004,JPO</p> |
