| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a high-density mounting can be attained and which can be repaired easily, and to provide its manufacturing method. SOLUTION: The semiconductor device is composed of a package substrate on which a semiconductor chip is mounted; a plurality of wires electrically connecting the surface electrode of the chip and the connecting electrode of the package substrate, a flexible substrate 4 which is connected to and formed on the package substrate so as to be projected from the package substrate, in which a plurality of external terminals 4a connected to a connector 10 are arrayed and formed at an end section, and which has flexibility; and a sealing body 5 sealing the chip and the wires. The flexible substrate 4 is attached to the connector 10 formed on the mounting substrate 9, and the substrate 4 is bent and a package body 11 is arranged in a space section on the substrate 9. Accordingly, an area required for a package mounting on the substrate 9 is reduced and packaging density can be increased. COPYRIGHT: (C)2004,JPO |
