| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package in which the length of wiring is shortened and which has an excellent transmission characteristic to high-frequency signals. SOLUTION: In the ceramic case, wiring patterns respectively provided on both surfaces of a ceramic substrate 10 are electrically connected to each other through an internal wiring pattern 30. The internal wiring pattern 30 is inclined against the thickness direction of the substrate 10 so that the pattern 30 may linearly connect inner patterns 14 provided on one surface of the substrate 10 to lands 26 provided on the other surface of the substrate 10. COPYRIGHT: (C)2004,JPO
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