发明名称 DEVICE FOR COOLING ELECTRONIC CHIP
摘要 PURPOSE: A device for cooling an electronic chip is provided to secure a sufficient radiating area in spite of the high integration of an internal space in a notebook computer by installing a radiating block to three directions. CONSTITUTION: A terminal base(110) transfers the heat by directly contacting to a heated element such as a CPU. The first heat pipe(130) is soldered to an upper part of the terminal base. The first radiating block(150) is vertically and horizontally soldered to an end of the first heat pipe. A fan motor(160) forcibly supplies a cooling fluid to the first radiating block. A base frame(170) fixes the fan motor and the terminal base. A fan cover(180) efficiently inflows/discharges the cooling fluid by blocking a majority portion excepting the upper center of the part installing the fan motor. The second radiating block(190) is perpendicular to the first radiating block. Thus, the air heat-exchanged by the first radiating block is discharged through the first outlet(102) and the air heat-exchanged by the second radiating block is discharged through a path(105) formed along a guide inner wall(104) formed on a cabinet(100) as one body.
申请公布号 KR20040052390(A) 申请公布日期 2004.06.23
申请号 KR20020080570 申请日期 2002.12.17
申请人 LG INNOTEC CO., LTD. 发明人 CHO, HYEON RAE
分类号 G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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