LASER DIODE ASSEMBLY

摘要

PURPOSE: An LD(Laser Diode) assembly is provided to effectively radiate a heat from an LD by enhancing a structure so that it elongates a life span and enhances a performance reliability. CONSTITUTION: The assembly comprises a semiconductor chip(100), a hologram element(130), a holder(140), a PCB(Printed Circuit Board, 150), the first heat radiation device(210) and the second heat radiation device(220). The semiconductor chip(100) mounts an LD(110) and a PD(Photo Detector, 120). The hologram element(130) is settled on the semiconductor chip(100). The holder(140), assembled with the semiconductor chip(100), supports the hologram element(130). The PCB(150) is connected to the semiconductor chip(100). The first heat radiation device(210) receives the heat from a back of the semiconductor chip(100), and radiates the heat via a rear heat radiation agent(211). The second heat radiation device(220) transfers the heat of the LD(110) to the holder(140).