| 摘要 |
PURPOSE: A heat treatment apparatus of semiconductor device manufacturing equipment and a processing method thereof are provided to be capable of considerably reducing process time. CONSTITUTION: A heat treatment apparatus of semiconductor device manufacturing equipment is provided with a chamber for selectively conserving an airtight state corresponding to the loading of a wafer, a heater(18) for enclosing the chamber, and a plurality of gas supply nozzles(36a,36b) installed in the chamber for supplying a variety of gases into the chamber. The heat treatment apparatus of semiconductor device manufacturing equipment further includes a plurality of exhaust lines(34a,34b) connected with the lateral portion of the chamber for exhausting the gases according to the kinds, and a control part for controlling the operation of the heat treatment apparatus.
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