| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser-beam machining apparatus, in which highly durable cutting plates for machining a thick plate coexists with cutting plates enabling the reduction of backside flaws in machining a thin plate. <P>SOLUTION: The laser-beam machining apparatus is provided with a work positioning means 7 freely conducting the travelling and positioning of a work W, which is supported by a work table 3, in X-axis direction, a laser-beam machining head 33 applying a concentrated laser-beam to the surface of the work, and a positioning means for the laser-beam machining head, which conducts the travelling and positioning of the laser-beam machining head in Y-axis direction orthogonal to the X-axis direction. The laser-beam machining head is provided so as to be positioned at a 1st machining position 47 and a 2nd machining position 49 which are mutually separated in the X-axis direction. A pair of cutting plates for a thick plate is provided at the 1st machining position of the work table, and a pair of cutting plates for a thin plate is provided at the 2nd machining position of the work table. <P>COPYRIGHT: (C)2004,JPO</p> |
