| 摘要 |
PROBLEM TO BE SOLVED: To reduce a difference in temperature in a plane of a wafer W, and also to reduce a response time until stabilizing the temperature of the plane of the wafer W during a transition. SOLUTION: A wafer support member 1 comprises a plurality of resistive heating elements 5 on one main surface or inside of a sheet-like ceramic body 2, and a mounting surface for mounting the wafer W on the other main surface. Three or more peripheral projections 4 are provided in a periphery of the mounting surface, and a low inside projection 8 is provided inside the peripheral projection. COPYRIGHT: (C)2004,JPO |
