| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipating properties of an electronic apparatus with an interposer board having a certain structure, such as an MCM structure. SOLUTION: A metal core board mounting an LSI chip thereon is used as the interposer board, a core metal is exposed on the rear surface of the metal core board opposite to its front surface where the LSI chip is mounted, soldering pads are formed directly on the exposed core metal, the metal core board is soldered to the mother board by the use of the soldering pads. COPYRIGHT: (C)2004,JPO |
