SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition having high reliability because of the freeness from short circuit incidental to reduction in a pitch among the connection electrodes and conductor wires of a semiconductor device. SOLUTION: The semiconductor sealing epoxy resin composition containing components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) a silica powder in which the content of spherical fused silica powder (c) is at least 50 wt.% based on the entire silica powder. Silica powder (c) is obtained by using the combustion heat of a mixed gas comprising a hydrogen gas and an oxygen gas as the heat source of fusing. COPYRIGHT: (C)2004,JPO