发明名称 INSULATION STRUCTURE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an insulation structure material that can reduce the factor of environmental burden which is a fate of insulation structure material that constitutes an electric component and an electronic component made mainly of a thermosetting matrix resin and an inorganic filler, which are essentially required of durability. SOLUTION: The insulation structure material contains a reactive organic filler, which is made of a cellulose derivative or a hemicellulose derivative that is transversion refined from a wooden resource as an original raw material, 5-100 mass % to the resin component, other than the thermosetting matrix resin and the inorganic filler. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004171799(A) 申请公布日期 2004.06.17
申请号 JP20020332923 申请日期 2002.11.15
申请人 TOSHIBA CORP 发明人 MAKISHIMA SATOSHI;MIYAGAWA MASARU;SAKAGUCHI OSAMU;SHIMIZU TOSHIO;KINOSHITA SUSUMU
分类号 C08K3/00;C08L101/00;H01B3/30;H01B3/40;(IPC1-7):H01B3/30 主分类号 C08K3/00
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