发明名称 Die cuttable label adhesive formulation
摘要 This invention is an adhesive formulation for die cuttable labels which comprises: (a) 100 parts by weight of a styrene-isoprene-styrene block copolymer having an overall number average molecular weight of 50,000 to 450,000, a polystyrene content of 10 to 25 percent weight, and a coupling efficiency of less than 70 percent, (b) from 5 to 30 parts by weight per 100 parts of block copolymer of polystyrene having a number average molecular weight of at least 50,000, (c) from 120 to 200 parts by weight per 100 parts of block copolymer of a tackifying resin, and (d) from 5 to 50 parts by weight per 100 parts of block copolymer of extending oil.
申请公布号 US2004116581(A1) 申请公布日期 2004.06.17
申请号 US20020321257 申请日期 2002.12.17
申请人 HANSEN DAVID R. 发明人 HANSEN DAVID R.
分类号 C08K5/01;C09J153/02;(IPC1-7):C08K5/01 主分类号 C08K5/01
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