发明名称 |
Ground lead with integrated bushing apparatus and method |
摘要 |
A grounding device comprising a ground lead and a support bushing wherein the ground lead and the support bushing comprise a unitary structure.
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申请公布号 |
US2004115972(A1) |
申请公布日期 |
2004.06.17 |
申请号 |
US20020316487 |
申请日期 |
2002.12.11 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
FORISKA MATTHEW FRANK;MARTIN GALEN M.;KANE VINCENT M. |
分类号 |
H01R4/64;H01R43/16;(IPC1-7):H01R4/66 |
主分类号 |
H01R4/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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