HOLDING JIG, MANUFACTURING METHOD OF SEMICONDUCTOR WAFER, AND METHOD FOR MOUNTING SEMICONDUCTOR SUBSTRATE AND HOLDING JIG

摘要

PROBLEM TO BE SOLVED: To provide a holding jig with which the number of processing wafers can easily be increased without remarkably changing a design of a device and a boat, and effective use and productivity of process gas can be improved, and to provide a manufacturing device of the semiconductor wafer and a mounting method of a semiconductor substrate and the holding jig. SOLUTION: The holding jig 6 is mounted on a supporting member 7 with a first semiconductor wafer W1 and a second semiconductor wafer W2, while the second semiconductor wafer W2 is held in parallel to the first semiconductor wafer W1 just above the first semiconductor wafer W1 held by the supporting member 7 in the boat 3. COPYRIGHT: (C)2004,JPO