| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board and the multilayer wiring board excellent in heat resistance and a reliability of adhesion after moisture absorption. <P>SOLUTION: The method for manufacturing the multilayer wiring board comprises the steps of (a) laminating a second polyimide wiring film having a polyimide surface of an oxide atom concentration of 20.0-30.0% measured by the X-ray photoelectron spectroscopy (XPS) at least on one side of a first plyimide wiring film having wiring patterns on both its sides with the interlayer conducted by blind via holes and with the other side having conductive layer arranged inside, through the adhesive layer, and (b) working the conductive layer to the prescribed wiring pattern. <P>COPYRIGHT: (C)2004,JPO</p> |
