Method and device for attaching a semiconductor chip to a chip carrier

摘要

In a method for attaching a semiconductor chip (10) to a chip carrier (12) thereby producing electrically conducting connections between contact areas arranged on a bottom surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) an anisotropically conducting paste or film (16) is applied to the chip carrier surface on which the contact areas (26, 28) are provided; the chip (10) is placed on the paste or film (16) so that its contact areas (22, 24) come to rest exactly over the contact areas (26, 28) of the chip carrier; heat is applied to the paste or film sufficient to cause hardening thereof and at the same time pressure is applied to the top side of the semiconductor chip (10) via an elastic body (20) causing or interstices between the contact areas (22, 24) on the bottom surface of the chip to be completely filled with the material of the paste or film (16) and causing said elastic body (20) to fold around the edges of the chip (10) to create an accumulation (32) of the material of the paste or film (16) around the entire chip (10).