| 发明名称 |
Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
| 摘要 |
Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications. |
| 申请公布号 |
US6750301(B1) |
申请公布日期 |
2004.06.15 |
| 申请号 |
US20000611899 |
申请日期 |
2000.07.07 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
BONNEAU MARK R.;SHIN YUN K.;HOANG GINA;SOBCZAK MARTIN |
| 分类号 |
C09J157/00;C08F290/06;C09J163/00;C09J163/02;C09J163/10;C09J201/00;C09J201/02;C09J201/10;(IPC1-7):C08L63/10 |
主分类号 |
C09J157/00 |
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代理人 |
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