| 摘要 |
A wafer dryer for use in a semiconductor cleaning apparatus includes an internal bath, an external bath, a solution supply line, a solution drain line, a pump, and drying means. The solution drain line has a first drain line and a second drain line. A pump for constantly maintaining a speed of a drained solution is installed on the first drain line. The drying means has an isopropyl alcohol (IPA) nozzle, a first gas spray nozzle for spraying N2 gas, and a second spray nozzle. The second spray nozzle is installed on all inner sidewalls of the external bath and has a plurality of holes. Thus, no wave is produced at a surface of the drained solution.
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