METHOD OF FABRICATING PIEZOELECTRIC COMPONENT HAVING REDUCED SIZE BY USING RESIN FILM AND PIEZOELECTRIC COMPONENT FABRICATED THEREBY

摘要

PURPOSE: A Method of fabricating a piezoelectric component having a reduced size by using a resin film and a piezoelectric component fabricated thereby are provided to prevent permeation of resin into the piezoelectric component by using a resin film instead of a liquefied resin. CONSTITUTION: A plurality of piezoelectric elements(2) having a vibrating portion and a bump are formed on a substrate. The piezoelectric elements are mounted on a mounting substrate(1) having external terminals via bumps(3) by using a flip chip bonding method. A resin film is arranged on the mounting substrate. The piezoelectric elements are sealed by embedding the resin film between the adjacent piezoelectric elements mounted on the mounting substrate. The resin film is hardened. The mounting substrate is split by a dicing process to form individual piezoelectric components; wherein. The sealing step includes a hot-press bonding process in which the resin film is heated, softened, and simultaneously pressed by a roller.