| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a flaw or a dent of a ball electrode, in the electrical characteristic inspection. SOLUTION: A semiconductor element having a plurality of element electrodes and a ball electrode 2 electrically connected to at least one of the plurality of element electrodes are provided. A pin 1 for inspecting the electrical characteristic is provided on the ball electrode 2. The characteristic inspection, the failure analysis, or the like of the semiconductor device can be performed by bringing the pin 1 into contact with an inspection jig. Accordingly, the flaw or the dent of the ball electrode 2, occurring by bringing the inspection jig such as the contact pin or the like into contact with the ball electrode 2, for applying a pressure, can be resolved. The problem such that the correct inspection cannot be performed, due to the adhesion of a solder scrap peeled off the ball electrode 2 to the side of the inspection jig, can be solved. COPYRIGHT: (C)2004,JPO
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