| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board improved in conductivity and adhesiveness in pads. <P>SOLUTION: The multilayer printed wiring board 10 is equipped with the pads 51 and 71 formed by filling the openings formed on the insulation layers 40 and 60 with metal. The pads 51 and 71 have such a structure as to have concave portions 55 and 71 whose diameter is 30-60% of a diameter of the via pads 51 and 71, and whose depth is 20-60% of the thickness of the via pads 51 and 71. Due to this structure, there is no seams or air voids in the concave portions 55 and 75 and an adhesion area with conductive structures formed on the pads 51 and 71 and the concave portions 55 and 75 can be enlarged, hence resulting in the improvements of conductivity and adhesiveness of the pads. <P>COPYRIGHT: (C)2004,JPO</p> |
