发明名称 |
Reworkable b-stageable adhesive and use in waferlevel underfill |
摘要 |
A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled miocroelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.
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申请公布号 |
US2004110010(A1) |
申请公布日期 |
2004.06.10 |
申请号 |
US20020310749 |
申请日期 |
2002.12.05 |
申请人 |
BUCHWALTER STEPHEN LESLIE;FEGER CLAUDIUS;HOUGHAM GARETH;LABIANCA NANCY;SHOBHA HOSADURGA |
发明人 |
BUCHWALTER STEPHEN LESLIE;FEGER CLAUDIUS;HOUGHAM GARETH;LABIANCA NANCY;SHOBHA HOSADURGA |
分类号 |
C08G65/26;H01L21/56;H01L23/29;(IPC1-7):B32B27/38 |
主分类号 |
C08G65/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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