| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which the electrode of an electronic component can be connected firmly to a soldering pad. SOLUTION: After an electroless-plated copper layer 3a is formed on the surface of an insulating substrate 1 in a coating state, a first plating resist layer 11 having an opening 11a is formed on the copper layer 3a and an electroplated copper layer 3b and an electroplated nickel layer 5 are successively formed on the portion of the copper layer 3a exposed in the opening 11a. Then, after the resist layer 11 is peeled off, a second plating resist layer 12 having a second opening 12a, through which the central part of the electroplated nickel layer 5 is exposed, is formed on the nickel layer 5 and an electroless-plated gold layer 6 is formed on the central part of the nickel layer 5 exposed in the opening 12a. After the second resist layer 12 is peeled off, in addition, the soldering pad 3 is formed by etching off the electroless-plated copper layer 3a except the portion for forming the soldering pad 3. Finally, a solder-resistant resin layer 4 is formed. COPYRIGHT: (C)2004,JPO
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