| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin coating method for semiconductor device, by which the resin coating can be performed easily and quickly. <P>SOLUTION: In the resin coating method for coating a semiconductor device 2 used for a liquid crystal panel 1 with a resin for coating, the resin 14 is formed in a sheet-like form, and the resin 14 for coating is put around a semiconductor 2. The resin 14 for coating is hardened, and the semiconductor 2 and its perimeter are coated and protected from moisture. The resin 14 for coating can be formed from resin for coating that can be hardened by chemical reaction by heating, ultraviolet curing type resin or the like. If a through hole 16 or recess is arranged in the center of the resin 14 for coating, and the semiconductor device 2 is inserted there, the position of the resin 14 for coating to the semiconductor 2 can be set as a fixed position all the time. <P>COPYRIGHT: (C)2004,JPO</p> |
