STRUCTURE FOR MOUNTING ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME AT LOW COST

摘要

PURPOSE: A structure for mounting an electronic part and a method of manufacturing the same are provided to reduce remarkably fabrication cost by forming a via hole through an insulating layer and the electronic part using a one-step etching process. CONSTITUTION: A wiring substrate(30) includes a predetermined wiring pattern(32a). An electronic part(20) is flip-chip connected to the wiring pattern via a connection terminal(10a). The connection terminal is formed on a device forming surface of the electronic part. The electronic part is coated with an insulating layer(34a). A via hole(36) is formed through the insulating layer and the electronic part. An upper wiring pattern(32b) is formed on the insulating layer to connect the connection terminal through the via hole. A side of the via hole is smoothly formed as the same surface from the insulating layer to the electronic part by using a one-step etching process.