| 摘要 |
PURPOSE: A semiconductor plating apparatus is provided to precisely detecting the fixing state between a metal plate and a hanger by using a proximity sensor and a gear type screw thread. CONSTITUTION: A semiconductor plating apparatus is provided with a plurality of hangers(202) for fixing a metal plate(104) and a transfer part(200) for transferring the hangers by carrying out a predetermined process. The semiconductor plating apparatus further includes a proximity sensor(206) for detecting whether the metal plate contacts the proximity sensor, or not. Preferably, the proximity sensor falls down, when the metal plate contacts the proximity sensor. Preferably, the semiconductor plating apparatus further includes a detecting sensor(208) for detecting the position shift of the proximity sensor. Preferably, the height of the proximity sensor is controlled by using a gear type screw thread.
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