发明名称 DEVICE MANUFACTURING EQUIPMENT AND DEVICE MANUFACTURING METHOD, ELECTRONIC INSTRUMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide device manufacturing equipment which can manufacture a device with desired performance capable of preventing dot defects by detecting a nonaction nozzle without reducing the throughput in manufacturing the device with a liquid drop ejection method. <P>SOLUTION: The device manufacturing equipment IJ is provided with an ejection head 1 for ejecting a liquid containing a functional material, a stage apparatus 2 supporting a substrate P to which the liquid is ejected and capable of moving relatively to the ejection head 1, a transfer apparatus 3 for transferring the substrate P, a detector 30 for detecting ejection conditions of the liquid ejected through a ejection nozzle 11 formed on the ejection head 1, and a control device CONT for implementing the detection operation with the detector 30. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004160449(A) 申请公布日期 2004.06.10
申请号 JP20030301295 申请日期 2003.08.26
申请人 SEIKO EPSON CORP 发明人 KAMIYAMA NOBUAKI;TAKAHASHI HAYATO
分类号 G02F1/13;B05C5/00;B05C11/10;B41J2/125;B41J29/393;H01J9/02;H01J9/227;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J11/42;H01L21/00;H01L21/027;H01L51/50;H05B33/10;(IPC1-7):B05C5/00;H01J11/02;H05B33/14 主分类号 G02F1/13
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